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ID PW   2024³â 3¿ù 19ÀÏ(È­) ¿ÀÈÄ 8:28:52
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Chemical Report
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Fine & Specialty Chemicals(Á¤¹ÐÈ­ÇÐ/½ºÆä¼ÈƼÄɹÌÄ®) Á¦Á¶ ¿ø´ÜÀ§ ¹× ÇÁ·Î¼¼½º(»ó,ÇÏ)
ÃѺз® : 442ÂÊ(A4)
°¡°Ý : 88¸¸¿ø
¹ßÇàÀÏ : 2016³â3¿ù
¹ßÇàó : Cischem
Directory of Chemical Products and Producers in China 2012
ÃѺз® : 1,082ÂÊ
Ã¥°¡°Ý : 70¸¸¿ø
¹ßÇàÀÏ : 2012³â3¿ù
¹ßÇàó : CNCIC
Home > °íºÐÀÚ ¿ë¾î»çÀü

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Àڱ⠰­È­ ź¼ºÃ¼ Self-reinforcing elastomer
Àڱ⠰æÈ­¼º Á¢ÂøÁ¦ Self-curing adhesive
Àڱ⠵µ°¡´Ï Porcelain crucible
Àڱ⠸ð¸àÆ® Magnetic moment
Àڱ⠹̼¼±¸ Magnetic microsphere
Àڱ⠺ÐÇØ Autolysis
Àڱ⠼ÒÈ­¼º Çöó½ºÆ½ Self-extinguishing plastics
ÀÚ±â Åõ°úµµ Magnetic permeability
ÀÚ±âÀå Magnetic field
ÀÚ±âÀû ¼ºÁú Magnetic property
ÀÚ±âÈ­ Magnetization
ÀÚ±âÈ­À² Magnetic susceptibility
ÀÚµ¿ ºÐ¼®±â Autoanalyzer
ÀÚµ¿ ¾ÐÃà ¼ºÇü Automatic compression molding
ÀÚ¸® ¿Å±è Rearrangement
ÀÚ¹ß °æÈ­ Self cure
ÀÚ¹ß ¹ÝÀÀ Spontaneous reaction
ÀÚ¹ß(Àû)°úÁ¤ Spontaneous process
ÀÚ¹ßÀû ÀÀ°í Spontaneous coagulation
ÀÚ¼® Á£°Ô Magnetic stirrer
ÀÚ¿¬ °æÈ­ Self cure
ÀÚ¿¬ ¹æ»ç´É Natural radioactivity
Àڿܼ± Ultraviolet ray
Àڿܼ± ºÐ±¤¹ý Ultraviolet spectrometry
Àڿܼ± Åõ°ú Ultraviolet transmission
Àڿܼ± Èí¼öÁ¦ Ultraviolet absorber
ÀÚÀ¯ ¶óµðÄ® Free radical
ÀÚÀ¯ ºÎÇÇ Free volume
ÀÚÀ¯ ¿¡³ÊÁö Free energy
ÀÚÀ¯ ¿¡³ÊÁö º¯È­ Free energy change
ÀÚÀ¯ ÀüÀÚ Free electron
ÀÚÀ¯ Ç¥¸é Free surface
ÀÚÀ¯µµ Degree of freedom
ÀÚÀ¯·Ó°Ô ȸÀüÇÏ´Â »ç½½ Freely-retation chain
ÀÚÀ¯¿¬°á»ç½½ Freely-jointed chain
ÀÚÀ¯È¸Àü »ç½½ Freely-rotation chain
ÀÚü »êÈ­ Alutoxidation
ÀÚü ¾ïÁ¦ Autoinhibition
ÀÚü Ã˸Š¹ÝÀÀ Autocatalytic reaction
ÀÚü ÃËÁø Autoacceleration
ÀÛ¾÷¼º Workability
ÀÛ¿ë±â Functional group
ÀÛ¿ë±âÈ­ Functionality
Àۿ뼺 Functionality
Àܱâ Residue
ÀÜ·ù ÀÀ·Â Residual stress
Àá¿­ Latent heat
Àå·Â Tension
Àå·Â ½ÃÇè Tension test
Àå·Â°è Tensiometer
À庮 Barrier
À庮 °íºÐÀÚ Barrier polymer
À庮 ¼öÁö Barrier resin
À庮¼º(Áú) Barrier property
Àå¿Ü Camphor
ÀåÆÄ »ö´Ü Bathochrome
ÀåÆÄ»ö´Ü[½É»ö]È¿°ú Bathochromic effect
ÀåÆÄÀå Âʿűè[À̵¿] Bathochromic shift
ÀæÀ½À² Frequency factor
Àç°¡¿­ ºí·Î¿ì ¼ºÇü Reheat blow molding
Àç°³½Ã ¹ÝÀÀ Reinitiation
Àç°áÁ¤ Recrystallization
Àç°æÈ­ Recuring
À籸¼º Reconstitution
Àç·Ã Re-milling
Àç·á°ø±Þ Feed
Àç¹è¿­ Rearrangement
Àç¹èÇâ Reorientation
ÀçºÐÆ÷ Redistribution
Àç»ý Recycling
Àç»ý Renaturation
Àç»ý °í¹« Reclaimed rebber
Àç»ý ¼¶À¯ Regenerated fiber
Àç»ý ŸÀ̾î Recapped tire
Àç»ý Çöó½ºÆ½ Recycled plastics
Àç»ýÁ¦ Reclaiming agent
Àç¾ÐÃà ¼ºÇü Recompression molding
Àç¾ÐÃà ¼ºÇü ½ÃÇè¹ý Recompression molding test
ÀçÁ¶ÇÕ Recombination
ÀçÁ¶ÇÕÇü DNARecombinant DNA
ÀçÁßÇÕ Repolymerization
ÀçħÀü Reprecipitation
ÀçÆí±Ø Repolarization
ÀçÇö¼º Reproducibility
Àú¹Ðµµ Æú¸®¿¡Æ¿·» Low-density polyethylene
Àú¾Ð ¼ºÇü Low-pressure molding
Àú¾Ð Æú¸®¿¡Æ¿·» Low-pressure polyethylene
Àú¿Â °¡È² Cold bulcanization
Àú¿Â °æÈ­¼º Á¢ÂøÁ¦ Cold setting adhesive
Àú¿Â °í¹« Cold rubber
Àú¿Â ¼ºÇü Cold molding
Àú¿Â ¾ÐÃâ Low-temperature extrusion
Àú¿ÂÇÐ Cryogenics
Àú¿ï Balance
ÀúÀå ¼ö¸í Storage life
ÀúÀå ź¼º·ü Storage modulus
ÀúÇÏ ¿î¹Ýü Charge carrier
ÀúÇ× ¿Âµµ°è Resistance thermometer
(Àü±â)ÀúÇ× Resistance
ÀúÇØ Inhibition
ÀúÇع° Inhibitor
Àûµµ ¹æÇâ Equaatorial
Àûµµ ¹æÇâ °áÇÕ Equatorial bond
Àûµµ ¹æÇâ ¸®°£µå Equatorial ligand
ÀûºÐ Èí±¤°è¼ö Total absorption coefficient
Àû½É Wetting
Àû½ÉÁ¦ Wetting agent
Àû¿Ü¼± Infrared ray
Àû¿Ü¼± Infrared
Àû¿Ü¼± °¡¿­ Infrared heating
Àû¿Ü¼± ºÐ±¤¹ý Infrared spectrometry
Àû¿Ü¼± ½ºÆåÆ®·³ Infrared spectrum
ÀûÀÀ È¿¼Ò Adaptive enzyme
ÀûÁ¤ Titration
ÀûÁ¤ °î¼± Titration curve
ÀûÁ¤ Áö¼ö Titration exponent
ÀûÃþ °¡°ø Laminated finishing
ÀûÃþ ¼ºÇü Laminated molding
ÀûÃþ ¾ÐÃâ Laminating extrusion
ÀûÇϺ´ Dripping bottle
Àü(ü)¾Ð·Â Total pressure
Àü°³ Development
Àü±Ø Electrode
Àü±Ø ±ÝÇü Electroformed mold
Àü±â µµ±Ý Electroplating
Àü±â ºÐ¼® È­ÇÐ Electroanalytical chrmistry
Àü±â ½Ö±ØÀÚ Electric dipole
Àü±â À½¼ºµµ Electronegativity
Àü±â À½¼ºµµ ôµµ Electronegativity scale
Àü±â Àüµµµµ ÀûÁ¤ Conductometric titration
Àü±â Àý¿¬ µµ·á Electrial insulation paint
Àü±â Ã˸ŠÀÛ¿ë Electrocatalysis
Àü±â·® ¹æ¹ý Coulometric method
Àü±âºÐÇØ Electrolysis
Àü±â¿µµ¿ Electrophoresis
Àü±âÀå Electric field
Àü±âÀúÇ× Electrical resistance
Àü±âÀúÇ׺ñ Electrical resistivity
Àü±âÈ­À² Electric susceptibility
Àü±âÈ­ÇÐ Electrrochemistry
Àü±âÈ­ÇÐ °¡°ø Electrochemical machining
Àü±âÈ­ÇÐ ´ç·® Electrochemical equivalent
Àü±âÈ­ÇÐ ¿¬¸¶ Electrochemical polishing
Àü±âÈ­ÇÐ Æ÷ÅÙ¼£ Electrochemical potential
Àü´Ü °­µµ Shear strength
Àü´Ü ¹±¾îÁü Shear thinning
Àü´Ü ÀÀ·Â Shear stress
Àü´Ü ÁøÇØÁü Shear thickening
Àü´Ü ź¼º·ü Shear modulus
Àü´ÜÀ² Shear rate
Àü´Þ Transfer
Àüµµ Conduction
Àüµµµµ Conductance
Àüµµµµ Conductivity
Àüµµ¼º Electroconducting[ve]
Àüµµ¼º °íºÐÀÚ Conductive[ng] polymer
Àüµµ¼º µµ·á Electroconductive paint
Àüµµ¼º ¼öÁö Electroconductive resin
Àüµµ¼º À×Å© Electroconductive ink
Àüµµ¼º Á¢ÂøÁ¦ Electroconductive adhesive
Àüµµ¼º Çöó½ºÆ½ Electroconductive plastics
ÀüµµÀ² Conductivity
Àü·ù Current
Àü·ù ¹Ðµµ Current density
Àü»ê±â[ÄÄÇ»ÅÍ] Áö¿ø ¼³°è Computer-aided design(CAD)
Àü»ê±â[ÄÄÇ»ÅÍ] Áö¿ø ¼³°è Computer-assisted design(CAD)
Àü»ê±â[ÄÄÇ»ÅÍ] Áö¿ø Á¦Á¶ Computer-assisted manufacturing(CAM)
ÀüÀ§Â÷ ÀûÁ¤ Potentiometric titration
ÀüÀ§Â÷¹ý Potentiometry
ÀüÀÌ Transition
ÀüÀÌ »óÅ Transition state
ÀüÀÌ ¿Âµµ Transition trmperature
ÀüÀÌ ¿ø¼Ò Transition element
ÀüÀÌ¿­ Heat of transition
ÀüÀÌÁ¡ Transition point
ÀüÀÚ Electron
ÀüÀÚ ²®Áú Electron shell
ÀüÀÚ ²ô´Â ±â Electron attracting group
ÀüÀÚ ²ô´Â ±â Electron withdrawing group
ÀüÀÚ ²ø±â Electron attracting
ÀüÀÚ ¹Þ°Ô[¼ö¿ëÁ¦] Electron acceptor
ÀüÀÚ º¼Æ® Electron volt
ÀüÀÚ »çÁø Xeography
ÀüÀÚ »óÀÚ¼º °ø¸í Electron paramagnetic resonance
ÀüÀÚ »óÀÚ¼º °ø¸í ºÐ±¤¹ý Electron paramagnetic resonance spectroscopy
ÀüÀÚ ½ºÆåÆ®·³ Electronic spectrum
ÀüÀÚ ½ºÇÉ °ø¸í Electron spin resonance(ESR)
ÀüÀÚ ½ºÇÉ °ø¸í ºÐ±¤¹ý Electron spin resonance spectroscopy
ÀüÀÚ ¿î¹Ý ÀÔÀÚ Electron transport particle
ÀüÀÚ ÁÖ°Ô[°ø¿©Ã¼] Electron donor
ÀüÀÚ Ä£È­µµ[¼º] Electron affinity
ÀüÀÚ ÇÔÁ¤ Electron trap
ÀüÀÚ È¸Àý Electron diffraction
ÀüÀڱ⠰£¼· Electromagnetic interference(EMI)
ÀüÀÚ±â Â÷Æó Electromagnetic shielding
ÀüÀÚÁÖ´Â ±â Electron donating group
ÀüÁÖ ±ÝÇü Electroformed mold
ÀüÁö Cell
ÀüÁö Electric cell
ÀüÂø µµÀå Electrodeposition coating
Àüü ȸÀü Overall rotation
ÀüÆÄ Propagation
ÀüÆÄ ´Ü°è Propagation step
ÀüÇÏ ¹Ðµµ Charge density
ÀüÇÏ ¼Ò¸ê Charge dissipation
ÀüÇÏ ¼Ò»ê Charge dissipation
ÀüÇÏ À̵¿ Charge transfer
ÀüÇÏ À̵¿ °è¼ö Charge transfer coefficient
ÀüÇÏ À̵¿ ¹ÝÀÀ Charge transfer reaction
ÀüÇÏ À̵¿ ÁßÇÕ Charge transfer polymerization
ÀüÇÏ À̵¿ Âø¹° Charge transfer complex
ÀüÇØ Electrolysis
ÀüÇØ ¿¬¸¶ Electrolytic polishing
ÀüÇØÁú Electrolyte
ÀüÈ­(À²) Conversion
Àý´Ü Cleavage
Àý´Ü Scission
Àý´Ü ÀúÇ× Cut resistance
Àý´ÜÃþ Cut-layer
Àý´ë ´ÜÀ§ Absolute unit
Àý´ë ¹è¿­ Absolute configuration
Àý´ë ½Àµµ Absolute humidity
Àý´ë ¿µµµ Absolute zero
Àý´ë ¿Âµµ Absolute temperature
Àý´ë À¯ÀüÀ² Absolute permittivity
Àý¿¬ Àç·á Insulating material
Àý¿¬ ÀúÇ× Insulation resistance
Àý¿¬ Æı« °­µµ Dielectric breakdown strength
Àý¿¬ Æı« ½ÃÇè Dielectric breakdown test
Àý¿¬ Æı« Àü¾Ð Dielectric breakdown voltage
Àý¿¬Áö (Electrical) insulating paper
Àý¿¬Ã¼ Insulator
Àý¿¬ÆÇ Insulating board
Á¡(¼º)µµ Viscosity
Á¡(¼º)µµ ¹ýÄ¢ Viscosity law
Á¡(¼º)µµ ¾ÈÁ¤È­ Viscosity stabilization
Á¡(¼º)µµ Áö¼ö Viscosity index
Á¡(¼º)µµ Æò±Õ ºÐÀÚ·® Viscosity average molecular weight
Á¡(¼º)µµ°è Viscometer
Á¡(¼º)µµ°è Viscosimeter
Á¡°á¼º Caking
Á¡°áÇÔ Point defect
Á¡¼ºµµ ºÎ¿©Á¦ Thickener
Á¡Àû ½ÃÇè Spot test
Á¡Âø Tack
Á¡Âø Cling
Á¡Âø ºÎ¿© Tackifier
Á¡Âø(¼º) Tackiness
Á¡Âø·Â Adhesive force
Á¡Âø¼º ¸»´Ü Sticky end
Á¡Åº¼º Viscoelasticity
Á¡Åä Clay
Á¡È­ Ignition
Á¢¸ñ °øÁßÇÕü Graft copolymer
Á¢½Ã Àú¿ï Platform balance
Á¢Âø Adhesion
Á¢Âø Àå·Â Adhesion tension
Á¢Âø Àü´Þ·Â Adhesion shear strength
Á¢Âø·Â Adhesive force
Á¢ÂøÁ¦ Adhesive
Á¢ÂøÁ¦ Cement
Á¢ÂøÁ¦ Glue
Á¢ÃË ¼ºÇü Contact molding
Á¢ÃË ÀÌ¿Â½Ö Contact ion pair
Á¢ÃË Á¢ÂøÁ¦ Contact adhesive
Á¢ÃË°¢ Contact angle
Á¢Ã˹ý Contact process
Á¢ÇÕ Fusion
Á¢ÇÕ ÀüÀ§ Junction potential
Á¢Èù »ç½½ Folded-chain
Á¢Èû Folding
Á£°Ô Stirrer
Á¤±Ô ¿ë¾× Regular solution
Á¤±Ô Áøµ¿Çü Normal mode of vibration
Á¤´ë Zone
Á¤·® Çö¹Ì°æ¹ý Quantitative microscopy
Á¤·ù Rectification
Á¤·ù°ü Rectifier
Á¤·ù±â Rectifier
Á¤¹ÝÀÀ Forward reaction
Á¤»ó Normal
Á¤»ó»óÅ Steady state
Á¤¼ö Clarification
Á¤À¯ Essential oil
Á¤Àü ±â·ÏÁö Electrostatographic paper
Á¤Àü µµÀå Electrostatic coating
Á¤Àü µµÀå Electrostatic painting
Á¤Àü ºÐü ÄÚÆà Electrostatic powder coating
Á¤Àü ½Ä¸ð Electrostatic flocking
Á¤Àü ¿ë·® Capccitance
Á¤Àü Àμâ Electrostatic printing
Á¤Àü Ç÷ÎÅ· Electrostatic flocking
Á¤Àü±â Àη Electrostatic attraction
Á¤Àü±â ÀüÇÏ Electrostatic charge
Á¤Àü±â ÈíÂø Electrostatic adsorption
Á¤Àü±â·Â Electrostatic force
Á¤Àü±âÀû »óÈ£ ÀÛ¿ë Electrostatic interacton
Á¤Àü·ù º¯¾Ð±â Constant current transformer
Á¤Á¦ Refining
Á¤Áö Termination
Á¤Áö ´Ü°è Termination step
Á¤Áö±â Stationary phase
Á¤Áö»ó Stationary phase
Á¤ÁöÁ¡ Rest point
Á¤ÁöÁ¦ Terminator
Á¤ÂøÁ¦ Anchoring agent
Á¤È­ Clarification
Á¥À½¼º[µµ] Wettability
Á¦°Å ¹ÝÀÀ Elimination reaction
Á¦°Å ÁßÇÕ Elimination polymerization
Á¦°ÅÁ¦ Scavenger
Á¦³íµî Xenon lamp
Á¦¶óƾȭ Gelatinization
Á¦¾î Control
Á¦ÀÎ Zein
Á¦Á¶ Fabrication
Á¦Å¸ ÀüÀ§ Zeta potential
Á¦Æ® ±³¹Ý±â Jet agitator
Á¦ÇÑ ÀÔ±¸ Restricted gate
Á©¶óƾ Gelatin
Á¬Æ® ±³¹Ý Jet ag(e)ing
Á¬Æ® ¹æ»ç Jet spinning
Á¬Æ® ¼ºÇü Jet molding
Á¶°ÇºÎ ¾ÈÁ¤µµ »ó¼ö Conditional stability constant
Á¶±â°æÈ­ Precure
Á¶±â°æÈ­ Premature cure
Á¶¸³ ±ÝÇü Family mold
Á¶¸³±â Spray granulator
Á¶»ç Rove
Á¶»ç Irradiation
Á¶»ö´Ü Aauxochrome
Á¶»ö´Ü Auxochromic group
Á¶¼º Composition
Á¶Àý Control
Á¶Àý ÀÎÀÚ Regulator
Á¶Àý±â Regulator
Á¶Àý¼º È¿¼Ò Regulatory enzyme
Á¶ÁØ Collimation
Á¶ÇÕ Combination
Á· Group
Á¸Àçºñ Abundance ratio
Á¹ Sol
Á¹°í¹« Sol rubber
Á¾ÀÌ Å©·¹¸¶Åä±×·¡ÇÇ Paper chromatography
Á¾À̹ÙÅÁ ÀûÃþž Paper base laminate
Á¾ÀÌ»óÀÚ Carton
Á¼±¼º Levorotatory
ÁËȸÀü¼º Leverotatory
ÁÖ ½ÅÀåºñ Principle extention ratio
ÁÖ ¿øÀÚ°¡ Principle valency
ÁÖ°¡¼Ò(¼º)¹°Áú Quasi-plastic materials
ÁÖ°Ô Donor
Áֱ⠰øÁßÇÕü Periodic copolymer
ÁÖ±âÀ² Periodic law
ÁÖ±âÀ²Ç¥ Periodic chart
ÁÖ±âÀ²Ç¥ Periodic table
ÁÖ±âÇ¥ Periodic chart
ÁÖ¸§ Crimp
ÁÖ¸§ Wrinkle
ÁÖ¸§ °øÁ¤ Corrugation process
ÁÖ¸§ ¹æÁö Crease proofing
ÁÖ¸§ ÀúÇ× Crease resistance
ÁÖ¸§ Á¢Èù °í¸® Puckered ring
ÁÖ¸Ó´ÏÇü È­ÇÕ¹° Cryptate
ÁÖ»ç ÀüÀÚ Çö¹Ì°æ Scanning electron microscope(SEM)
ÁÖ»ç Åͳθµ Çö¹Ì°æ Scanning tunneling microscope(STM)
Áֻ罽 Main chain
ÁÖ¼â Main chain
ÁÖÇü Casting
ÁÖÇü ¼ºÇü Cast molding
ÁÖÇü¿ë ¼öÁö Casting resin
ÁØ Quasi
ÁØ°¡±³ Quasi-crosslink
ÁØ°­ÀÚ¼º Ferrimagnetism
ÁØ°ÝÀÚ ¸ðÇü Quasi-lattice model
ÁØ°áÁ¤ ±¸Á¶ Quasi-crystalline structure
ÁØ°áÁ¤¼º °íºÐÀÚ Semicrystalline polymer
Áصî¿Â Á¶°Ç Quasi-isothermal conditions
Áع̷® ºÐ¼® Semimicre analysis
Áع̷® Àú¿ï Semimicro balance
ÁغÐÇØ[Àý´Ü] Quasi-cleavage
ÁØ»ç´Ù¸®Çü °íºÐÀÚ Semiladder polymer
ÁØ»óȣħÅõ °íºÐÀÚ Semiinterpenetrating polymer
ÁؾÈÁ¤ Metastable
ÁؾÈÁ¤ ÆòÇü Metastable equilibrium
ÁؾËÂ¥ ¹ÝÀü Quasi-net inversion
ÁØÀÚÀ¯ÀüÀÚ Quasi-free electron
ÁØÁ¤»ó »óÅ Quasi-steady state
ÁØÁ¤Áö(ÀÇ) Quasi-stationary
ÁØź¼º ±¤»ê¶õ Quasi-elastic light scattering
ÁØź¼º¹ý Quasi-elastic method
ÁØÈñ¹Ú¿ë¾× Semidilute solution
Áß°£ ¹°Áú Intermediate
Áß°£Ã¼ Intermediate
Áß°ø»ç Hollow fiber
Áßµ¶(ÀÛ¿ë) Poisoning
Áß·® Æò±Õ ºÐÀÚ·® Weight-average molecular weight
Áߺΰ¡ Polyaddition
Áß¼º Neutral
Áß¼ºÀÚ Neutron
Áß¼ºÀÚ ¹æÃâ Neutron emission
Áß¼ºÀÚ »ê¶õ Neutron scattering
Áß¼ö Heavy water
Áß¼ö¼ÒÈ­ ÁßÇÕü Deuterated polymer
Áß¼ö¼ÒÈ­(¹ÝÀÀ) Deuteration
Á᫐ Center
Áß¿Â °æÈ­ Á¢ÂøÁ¦ Intermediate temperature setting adhesive
Áßø ¿ø¸® Superposition principle
ÁßÅ©·Ò»ê¿° Dichromate
ÁßÅÁ Bath
ÁßÇÕ °³½ÃÁ¦ Polymerization initiator
ÁßÇÕ ±ÝÁöÁ¦ Polymerization inhibitor
ÁßÇÕ ¹ÝÀÀ±â Polymerization reactor
ÁßÇÕ ¼Óµµ Polymerization rate
ÁßÇÕ Áö¿¬Á¦ Polymerization retarder
ÁßÇÕ Ã˸ŠPolymerization catalyst
ÁßÇÕ(¹ÝÀÀ) Polymerization
ÁßÇÕµµ Degree of polymerization
秂͟ Polymer
ÁßÇØ Àç»ý¹ý Digester reclaiming process
ÁßÈ­ °î¼± Neutralization curve
ÁßÈ­¿­ Heat of neutralization
Áõ°¨Á¦ Sensitizer
Áõ±â Vapo(u)r
Áõ±â ¾Ð·Â Vapor pressure
Áõ±â ¾Ð·Â ³»¸² Vapor pressure lowering
Áõ±â ¿­±³È¯±â Vapor heat exchanger
Áõ±âÅõ°ú¼º(µµ) Vapor permeavility
Áõ·®Á¦ Extender
Áõ·ù Distillation
Áõ·ù±â Retort
Áõ·ù¼ö Distilled water
Áõ¹ß Evaporation
Áõ¹ß Vaporization
Áõ¹ß Á¢½Ã Evaporating dish
Áõ¹ß¿­ Heat of vaporization
Áõ¹éÁ¦ Brightening agent
Áõ¹éÁ¦ Whitening agent
Áö±¸ È­ÇÐ Geochemistry
Áö±×Àç±×Çü »ç½½ Zig-zag chains
Áö±Û·¯-³ªÅ¸ Ã˸ŠZiegler-Natta catalyst
Áö´ë Zone
Áö¸§ ºÐÆ÷ Radial distribution
Áö¹® ¿µ¿ª Fingerprint region
Áö¹æ ´Ü¹éÁú Lipoprotein
Áö¹æÁ· °í¸® È­ÇÕ¹° Alicyclic compound
Áö¹æÁ· È­ÇÕ¹° Aliphatic compound
Áö¼ö Index
Áö½Ã Àü±Ø Indicator electrode
Áö½Ã°è Indicator
Áö½Ã¾à Indicator
Áö½Ã¾à »ó¼ö Indicator constant
Áö¿¬ Retardation
Áö¿¬ ½Ã°£ Retardation time
Áö¿¬Á¦ Retarder
Áö¿ë¼º Fat-soluble
ÁöÁö Ã˸ŠSupported catalyst
ÁöÁú Lipid
ÁöÇ¥ Index
ÁöÇÔ Carton
ÁöÇ⼺±â Directing group
Á÷±³ ÁÂÇ¥ Cartesian coordinate
Á÷¸³ Ä®·»´õ Vertical calender
Á÷¹° Texture
Á÷¹° ÀûÃþÇ° Fabric base laminate
Á÷Á¢ ¹æ»ç Direct spinning
Á÷Á¢ ¿°·á[¹°°¨] Direct dye
Á÷Á¢ ÁõÇعý Direct cooking process
Á÷Æ÷ Woven fabric
Áø°ø Vacuum
Áø°ø °ÇÁ¶±â Vacuum drier
Áø°ø ½ÎÀÌ¡ Vacuum sizing
Áø°ø ÁÖÇü Vacuum casting
Áø°ø Áõ·ù Vacuum distillation
Áø°ø ÆßÇÁ Vacuum pump
Áø°ø°è Vacuum gauge
Áø°ø¹é ¼ºÇü Vacuum bag molding
Áø°øÁõÂø Vacuum metallizing
Áø°øÆ÷Àå Vacuum package
Áøµ¿ Vibration
Áøµ¿ °¨¼â Vibration damping
Áøµ¿ ¹æ½Ä Vibration mode
Áøµ¿ ºÐ±¤ÇÐ Vibration spectroscopy
Áøµ¿ ¿¡³ÊÁö Vibration energy
Áøµ¿[ÁÖÆÄ]¼ö Frequency
Áøµ¿¼ö À̵¿ Vibration shift
Áøµ¿¼ö ÀÎÀÚ Vibration factor
Áøµ¿ÀÚ Oscillator
Áøµ¿-ȸÀü ½ºÆåÆ®·³ Vibration-rotation spectrum
ÁøÁÖ ÁßÇÕ Pearl polymerization
ÁøÈë Clay
Áú°¨ Texture
Áú±è Toughness
Áú·® Mass
Áú·® º¸Á¸ ¹ýÄ¢ Conservation law of mass
Áú·® º¸Á¸ÀÇ ¹ýÄ¢ Law of mass conservation
Áú·® ºÐ¼®°è Mass spectrometer
Áú·® ºÐ¼®±â Mass spectroscope
Áú·® ºÐÆ÷ºñ Mass distribution ratio
Áú·®¼ö Mass number
Áú»êÈ­(¹ÝÀÀ) Nitrification
Áú¼ÒÈ­(¹ÝÀÀ) Nitrification
Áü Ç÷ÎÆ® Zimm plot
Áý°Ô Clamp
Áý±¤ ·»Áî Condensing lens
Áý¼Ó ¼Óµµ Focusing velocity
ÁýÀûȸ·Î Integrated circuits(IC)
ÁýÇÕ Aggregation
¦ Couple
¦ ´Ü·®Ã¼ Conjugative monomer
¦ ÀÌÁß °áÇÔ Cconjugated double bond
¦(Áö¾îÁø)¹ÝÀÀ Coupled reaction
¦±º Conjugate group
¦»ê Conjugate acid
¦¿°±â Conjugate base
¦ÁöÀ½ Coupling
¦ÁöÀ½ ¹ÝÀÀ Ccoupling reaction
¦Áþ±â Conjugation
¦Ǯ¸² Decoupling
ÂÉ°³Áö±â Fragmentation
ÂÊ»ö Indigo
ÂØÀÓ Irradiation
ÂêºñÅÍ ÀÌ¿Â Zwitter ion
Âî³¢ Residue
ÂïÈû Couple
Z-Æò±Õ ºÐÀÚ·® Z-average molecular weight


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